公开(公告)号：US20230120584A1

公开(公告)日：2023-04-20

申请号：US17876449

申请日：2022-07-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Ali ,  Richard Wallace ,  Swaminathan Sankaran

IPC: H01Q1/22 ,  H05K1/02 ,  H01L23/66

Abstract: In one example, an apparatus comprises an integrated circuit, a first metal layer, and a second metal layer. The first metal layer includes a first antenna connected to the integrated circuit, the first antenna being in a first region, the first region being external to the integrated circuit. The second metal layer includes a second antenna in a second region external to the integrated circuit. The apparatus further comprises a substrate between the first and second metal layers, in which the substrate and the first and second metal layers form a laminate. The apparatus further comprises a through-via in the substrate that couples between the first and second antennas.