System and method for predicting failure initiation and propagation in bonded structures

    公开(公告)号:US10997330B2

    公开(公告)日:2021-05-04

    申请号:US16274868

    申请日:2019-02-13

    Abstract: A method includes obtaining failure initiation characteristics of a bonding layer of one or more bonded structures and determining, based on the failure initiation characteristics, a first characteristic dimension for each analysis element of a first portion of a finite element analysis model. The method includes obtaining failure propagation characteristics of the bonding layer and determining, based on the failure propagation characteristics, a second characteristic dimension for each analysis element of a second portion of the model. The method includes assigning a first set of material parameters to analysis elements of the first portion of the model and assigning a second set of material parameters to analysis elements of the second portion of the model. The method includes evaluating failure modes of the one or more bonded structures based on a solution to the model, the first set of material parameters, and the second set of material parameters.

    SYSTEM AND METHOD FOR PREDICTING FAILURE INITIATION AND PROPAGATION IN BONDED STRUCTURES

    公开(公告)号:US20200257768A1

    公开(公告)日:2020-08-13

    申请号:US16274868

    申请日:2019-02-13

    Abstract: A method includes obtaining failure initiation characteristics of a bonding layer of one or more bonded structures and determining, based on the failure initiation characteristics, a first characteristic dimension for each analysis element of a first portion of a finite element analysis model. The method includes obtaining failure propagation characteristics of the bonding layer and determining, based on the failure propagation characteristics, a second characteristic dimension for each analysis element of a second portion of the model. The method includes assigning a first set of material parameters to analysis elements of the first portion of the model and assigning a second set of material parameters to analysis elements of the second portion of the model. The method includes evaluating failure modes of the one or more bonded structures based on a solution to the model, the first set of material parameters, and the second set of material parameters.

Patent Agency Ranking