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公开(公告)号：US20230300980A1
公开(公告)日：2023-09-21
申请号：US18014760
申请日：2021-07-09
Applicant: THE UNIVERSITY OF HONG KONG
Inventor： Chik Ho Choy , Xinjun He
IPC: H05K1/09 , H01L31/0224
CPC classification number: H05K1/097 , H01L31/022425 , H01L31/022491 , H05K2201/10143 , H05K2203/1131
Abstract: Disclosed are methods of sintering metal nanoparticles and methods of making conductive metal films.
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