公开(公告)号：US20190301912A1

公开(公告)日：2019-10-03

申请号：US16361410

申请日：2019-03-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Risako MIYOSHI ,  Norihiko AMIKURA ,  Kazuyuki MIURA ,  Hiroshi YAZAKI ,  Yasuhiro SHOJI

IPC: G01F7/00 ,  G01F1/34 ,  G01F15/00

Abstract: A substrate processing system according to an exemplary embodiment includes a substrate processing apparatus and a measurement apparatus. The substrate processing apparatus includes a gas supply unit. The gas supply unit includes a flow rate controller and a secondary valve. The secondary valve is connected to a secondary side of the flow rate controller. The secondary valve is opened when a voltage is output from a first controller of the substrate processing system through a wiring. The measurement apparatus measures the flow rate of the gas output from the flow rate controller according to the instruction from the first controller. The measurement apparatus includes a second controller. The measurement apparatus includes a relay provided on the wiring. The second controller is configured to control the relay.