公开(公告)号：US20200270815A1

公开(公告)日：2020-08-27

申请号：US16646675

申请日：2018-09-19

Applicant: TOMOEGAWA CO., LTD.

Inventor： Hideki MORIUCHI ,  Hiroshi KITAHARA ,  Masanori TAKAHATA ,  Masanori MORINAGA ,  Tomoki FURUE

IPC: D21H11/04 ,  D21H11/12 ,  D21H13/24 ,  D21H25/00 ,  B32B37/10 ,  B32B37/26

Abstract: An object of the present invention is to provide a thermoplastic fiber sheet that can be pressure bonded even at low temperatures and can prevent an event of a decrease in operational reliability of electronic components and electronic materials after pressure bonding.Provided is a thermoplastic fiber sheet composed of at least cellulosic fibers and thermoplastic resin fibers having a softening temperature of 100 to 140° C., in which the weight ratio of the cellulosic fibers to the thermoplastic resin fibers (the cellulosic fibers:the thermoplastic resin fibers) is 4:6 to 2:8, and the porosity is 20 to 70%.