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公开(公告)号：US20230422355A1
公开(公告)日：2023-12-28
申请号：US18036818
申请日：2021-11-17
Applicant: TOMOEGAWA CO., LTD.
Inventor： Maika KOKUI YAMAJI , Hideki MORIUCHI , Taku KURAHARA
IPC: H05B3/54
CPC classification number: H05B3/54
Abstract: A heating structure includes: an object to be heated that has recesses on the surface thereof; a laminate-type heater that includes a heat-generating layer and a layer covering the same; and a filler that has flexibility and higher thermal conductivity than air, and is inserted into the recesses between the surface of the object and the surface of the laminate-type heater.
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