CARD MEDIUM, ELECTRONIC COMPONENT FOR CARD MEDIUM, AND METAL CARD SUBSTRATE FOR CARD MEDIUM

    公开(公告)号:US20230306214A1

    公开(公告)日:2023-09-28

    申请号:US18202839

    申请日:2023-05-26

    Applicant: TOPPAN INC.

    CPC classification number: G06K7/10366

    Abstract: A card medium includes: a card body containing a metal material and having at least one aperture at a front surface thereof; an electronic component disposed in the at least one aperture and having an outer peripheral surface facing an aperture inner peripheral surface of the at least one aperture with a clearance from the aperture inner peripheral surface, at least part of the outer peripheral surface including a conductor exposed portion at which a conductor having conductive properties is exposed; a circuit substrate which is embedded into the card body and to which the electronic component is joined; and an electrical insulation portion provided between the electronic component and the aperture inner peripheral surface.

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