公开(公告)号：US12141644B2

公开(公告)日：2024-11-12

申请号：US18202839

申请日：2023-05-26

Applicant: TOPPAN INC.

Inventor： Yukiko Katano ,  Misaki Nonaka ,  Shinji Kaneko

IPC: G06K7/10

Abstract: A card medium includes: a card body containing a metal material and having at least one aperture at a front surface thereof; an electronic component disposed in the at least one aperture and having an outer peripheral surface facing an aperture inner peripheral surface of the at least one aperture with a clearance from the aperture inner peripheral surface, at least part of the outer peripheral surface including a conductor exposed portion at which a conductor having conductive properties is exposed; a circuit substrate which is embedded into the card body and to which the electronic component is joined; and an electrical insulation portion provided between the electronic component and the aperture inner peripheral surface.