IC card and method for manufacturing IC card

    公开(公告)号:US12217112B2

    公开(公告)日:2025-02-04

    申请号:US18134959

    申请日:2023-04-14

    Applicant: TOPPAN INC.

    Abstract: An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.

Patent Agency Ranking