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公开(公告)号：US20230139647A1
公开(公告)日：2023-05-04
申请号：US18149343
申请日：2023-01-03
Applicant: TOPPAN INC.
Inventor： Tokinoya Osamu , Furuta Kaoru , Kinoshita Kayo
Abstract: A resin film configured to form, together with a gas barrier layer, a laminate for producing a packaging body. The resin film contains polyethylene terephthalate. In a loss tangent curve indicating the relationship between tan δ and temperature of the resin film, the tan δ at a peak position is 0.160 or more and 0.190 or less.
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