公开(公告)号：US20230290798A1

公开(公告)日：2023-09-14

申请号：US18320504

申请日：2023-05-19

Applicant: TOPPAN Inc.

Inventor： Norihiko OSHIMA ,  Wataru NOZAKI

IPC: H01L27/146

CPC classification number: H01L27/14621 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

Abstract: A solid-state image sensor includes a substrate, photoelectric conversion elements positioned on the substrate, a filter module positioned above the photoelectric conversion elements positioned on the substrate, lenses positioned above the filter module positioned above the photoelectric conversion elements, a resin layer formed such that the resin layer is surrounding an outer edge of the filter module positioned on the substrate, and an anti-reflection film formed on the lenses and resin layer such that the anti-reflection film has a peripheral film portion covering a peripheral portion of the resin layer. The filter module is positioned such that light is transmitted through the filter module before being incident on the photoelectric conversion elements, and the anti-reflection film is formed such that the peripheral film portion has an uneven shape having unevenness in thickness direction of the resin layer and at least part of an outer edge protruding outside the resin layer.