公开(公告)号：US11881414B2

公开(公告)日：2024-01-23

申请号：US17113929

申请日：2020-12-07

申请人： TOPPAN PRINTING CO.,LTD.

发明人： Masashi Sawadaishi

IPC分类号： H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  C03C23/00 ,  C03C15/00 ,  H01L21/683

CPC分类号： H01L21/4857 ,  H01L23/15 ,  H01L23/49822

摘要： A glass device including a thin glass substrate which has a glass thickness of 300 μm or less is enabled to be provided more easily. In a method for manufacturing the glass device, one or more through holes are formed in a glass substrate, and a first wiring on a first surface side of the glass substrate and a second wiring on a second surface side of the glass substrate are electrically connected to each other via the through holes. After the first wiring is provided, the through holes are formed while the glass substrate is being thinned by etching. Then, wirings in the through holes and the second wiring are formed. The thinned glass substrate has a thickness of 50 μm or more and 300 μm or less. The through holes have the shape of a truncated cone.