公开(公告)号：US20170173842A1

公开(公告)日：2017-06-22

申请号：US15323877

申请日：2015-07-27

申请人： TOYO SEIKAN CO., LTD

发明人： Norihisa HIROTA ,  Atsushi YONEDA ,  Kouichi NARUTAKI ,  Akihiro USAMI ,  Eiichiro KANEKO ,  Takuo YAMADA ,  Youtarou TAKAHASHI ,  Ikuo KOMATSU

IPC分类号： B29C49/42 ,  B29C49/28 ,  B29C49/04 ,  B29C49/10

CPC分类号： B29C49/4205 ,  B29C49/04 ,  B29C49/10 ,  B29C49/28 ,  B29C49/36 ,  B29C49/42 ,  B29C49/70 ,  B29C2049/5844 ,  B29C2793/0027 ,  B29C2793/0081 ,  B29K2105/253 ,  B29L2031/7158

摘要： A blow molding capable of maintaining the parison thickness distribution uniform, fabricating high-quality molded products, and improving its productivity. A parison supply device for supplying, to a blow mold, a parison discharged from an extrusion die, the parison supply device including: a pair of chucks for pinching, from above and below, a parison discharged downward from the extrusion die; and a chuck operation part for controlling an operation of pinching the parison by the pair of chucks and an operation of moving the pair of chucks. By the chuck operation part, the pair of chucks performs the operation of pinching the parison while being moved downward.