公开(公告)号：US20190165558A1

公开(公告)日：2019-05-30

申请号：US16149761

申请日：2018-10-02

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Toshio KATAGAI ,  Hidehiko MATSUI ,  Shinji OSHITA ,  Atsuyuki WAKAMATSU ,  Hiroki KAWAKAMI ,  Kazunori TAKATA ,  Shin UMEHARA ,  Taku FURUTA

IPC分类号： H02G5/02

CPC分类号： H02G5/02 ,  B60R16/03 ,  H01B7/0018 ,  H01B7/0045 ,  H01B9/006

摘要： A flat wiring structure is including a plurality of layers, and includes a power supply layer, and a first ground layer and a second ground layer laminated with the power supply layer sandwiched therebetween. In a plan view of the flat wiring structure when viewed from a direction along a lamination direction of the first ground layer, the power supply layer, and the second ground layer, the power supply layer has a width in a short direction smaller than those of the first ground layer and the second ground layer, and the power supply layer is provided at a position covered with the first ground layer and the second ground layer.