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公开(公告)号：US20200035588A1
公开(公告)日：2020-01-30
申请号：US16491328
申请日：2018-02-16
发明人： Takanori KAWASHIMA , Hirotaka OHNO
IPC分类号： H01L23/495 , H01L23/00
摘要： A semiconductor device that is capable of suitably dissipating heat from a semiconductor chip is proposed. The proposed semiconductor device may include a semiconductor chip provided with a semiconductor substrate and a surface electrode provided on a surface of the semiconductor substrate; and a conductive plate provided with a plate shape portion and a convex portion protruding from the plate shape portion. An end surface of the convex portion may be corrected to the surface electrode. A width of the end surface of the convex portion may be narrower than a width of a base portion of the convex portion on a plate shape portion side.
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公开(公告)号：US20200321884A1
公开(公告)日：2020-10-08
申请号：US16832048
申请日：2020-03-27
发明人： Masataka DEGUCHI , Akihiro UEDA , Koji YASUI , Hirotaka OHNO
摘要： A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.
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公开(公告)号：US20180286702A1
公开(公告)日：2018-10-04
申请号：US15902479
申请日：2018-02-22
发明人： Takanori KAWASHIMA , Hirotaka OHNO
IPC分类号： H01L21/48 , H01L23/495 , H01L23/00
摘要： A method of manufacturing a semiconductor device by connecting a semiconductor chip to a lead frame using a jig, the semiconductor chip including a main electrode provided at a surface of the semiconductor chip, the lead frame including a connection projecting portion and a positioning portion, the positioning portion including at least one of a convex shape and a concave shape provided around the connection projecting portion, the method may include: engaging the jig to the positioning portion in a state where a clearance is provided between the connection projecting portion and the jig; engaging the jig to the semiconductor chip; and connecting the connection projecting portion to the main electrode of the semiconductor chip via solder in a state where the jig is engaged to the positioning portion and the semiconductor chip.
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