公开(公告)号：US20250167475A1

公开(公告)日：2025-05-22

申请号：US18946054

申请日：2024-11-13

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Hiroshi KAWANISHI ,  Shingo NAGAI ,  Kengo OHIRA ,  Kenta KODAMA ,  Koichi KUWAHARA ,  Shogo KAJIMOTO ,  Masashi IZUMI ,  Yuichiro KANADA ,  Takuya ISOMURA

IPC: H01R13/187

Abstract: A terminal connection structure includes a male terminal having a columnar shape; a female terminal having a hole to which the male terminal is inserted; a first contact member interposed between the male terminal and the female terminal and electrically connecting the male terminal to the female terminal; and a second contact member interposed between the male terminal and the female terminal and electrically connecting the male terminal to the female terminal.

公开(公告)号：US20190355653A1

公开(公告)日：2019-11-21

申请号：US16383746

申请日：2019-04-15

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Takanori KAWASHIMA ,  Hitoshi OZAKI ,  Takuya ISOMURA

IPC: H01L23/498 ,  H01L25/07 ,  H01L23/00 ,  H01L23/31 ,  H01L23/482

Abstract: A semiconductor device may be provided with a first semiconductor element including a plurality of signal electrodes, a second semiconductor element including a plurality of signal electrodes, an encapsulant encapsulating the first semiconductor element and the second semiconductor element, and a plurality of signal terminals protruding from the encapsulant. The plurality of signal terminals may include a first signal terminal, a second signal terminal and a common signal terminal. The first signal terminal may be connected with one of the signal electrodes of the first semiconductor element within the encapsulant. The second signal terminal may be connected with one of the signal electrodes of the second semiconductor element within the encapsulant. The common signal terminal may be, within the encapsulant, connected with another one of the signal electrodes of the first semiconductor element and another one of the signal electrodes of the second semiconductor element.