公开(公告)号：US12206975B2

公开(公告)日：2025-01-21

申请号：US18072585

申请日：2022-11-30

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Fei-Fan Yu

IPC: H04N23/57 ,  H01L21/02 ,  H01L23/48 ,  H01R4/04 ,  H04N23/51 ,  H04N23/55 ,  H05K1/09 ,  H05K1/18

Abstract: A connecting assembly comprises a substrate, a layer of conductive adhesive with conductive particles, a connection board, and a light transmission component. The connection board and the light transmission component are both glued to the substrate by the layer of conductive adhesive therebetween, and an operator can observe the a degree of deformation of the conductive particles in the layer of conductive adhesive to determine whether a conductive connection between the light transmission component and the substrate is affected. The connecting assembly allows an operator to effectively observe conductivity of every product in a nondestructive manner. A camera module comprising the connecting assembly and an electronic device are also disclosed.