Material loading device
    2.
    发明授权

    公开(公告)号:US11760567B2

    公开(公告)日:2023-09-19

    申请号:US17830514

    申请日:2022-06-02

    CPC classification number: B65G1/02 B65D7/10 B65D25/2858

    Abstract: A material loading device includes a loading frame and at least one first locking mechanism. The loading frame defines a receiving cavity and at least one opening communicating with the receiving cavity. Opposing inner walls of the loading frame define a plurality of first slots. The at least one first locking mechanism is disposed at the at least one opening. The at least one first locking mechanism includes a first locking portion extending downwards. The first locking portion includes a plurality of second slots and a plurality of blocks adjacent to the plurality of second slots. The first locking portion can drop by gravity, driving the plurality of blocks to move to and lock the plurality of first slots. The first locking portion can also be lifted, to drive the plurality of second slots to move to and unlock the plurality of first slots.

    Heat dissipating base and light emitting device without additional cooling

    公开(公告)号:US10731842B1

    公开(公告)日:2020-08-04

    申请号:US16671700

    申请日:2019-11-01

    Abstract: A heat dissipating base for a light-emitting element sufficient to dissipate generated heat without additional means of dissipating includes a first base plate and a second base plate formed on the first base plate. The first base plate includes first sidewalls. The second base plate includes second sidewalls. The first base plate defines a first groove, the first groove passes through one first sidewall to form a first cutout. The second base plate defines a second groove, the second groove passes through one second sidewall to form a second cutout. The first cutout and the second cutout correspond to each other and cooperatively form a heat dissipating opening. The first groove and the second groove correspond to each other and cooperatively form a channel for dissipating heat. A light emitting device having such heat dissipating base is also provided.

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