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公开(公告)号：US11003056B2
公开(公告)日：2021-05-11
申请号：US16182561
申请日：2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma
IPC: G03B17/55 , G02B7/04 , G03B11/00 , G02B7/00 , G02B7/02 , G02B1/14 , G03B13/34 , G02B27/00 , H04N5/225
Abstract: A camera includes a bracket, a lens base, a lens, a filter, a circuit board, and a photosensitive, chip. The bracket defines a first receiving space, a second receiving space, and a through hole. The through hole is in communication with the first receiving space and the second receiving space. The lens is mounted on the lens base. The filter is received within the first receiving space. The circuit board is mounted on the side of the bracket defining the second receiving space. The photosensitive chip mounted on the circuit board faces the through hole. The bracket includes a heating member and two conductive circuits. The filter is mounted on the heating member such that a periphery of the filter is in contact with the heating member. Each of the two conductive circuit layers is electrically coupled between the heating member and the circuit board to heat the filter.
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公开(公告)号：US10965851B2
公开(公告)日：2021-03-30
申请号：US16558596
申请日：2019-09-03
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Shin-Wen Chen , Long-Fei Zhang , Kun Li , Xiao-Mei Ma
IPC: H04N5/225 , H05K1/18 , H05K1/14 , H01L23/00 , H01L27/146
Abstract: A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.
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公开(公告)号：US11470228B2
公开(公告)日：2022-10-11
申请号：US16899781
申请日：2020-06-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
Abstract: A camera module includes a circuit board; and a lens module electrically connected with the circuit board. The lens module is configured to be capable of deformed when being applied a voltage thereon so as to change a focus length of the lens module.
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公开(公告)号：US10574870B2
公开(公告)日：2020-02-25
申请号：US16040855
申请日：2018-07-20
Inventor： Long-Fei Zhang , Shin-Wen Chen , Kun Li , Xiao-Mei Ma
Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.
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公开(公告)号：US12282202B2
公开(公告)日：2025-04-22
申请号：US17830511
申请日：2022-06-02
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma , Ding-Nan Huang
Abstract: An impact- and vibration-proof lens module includes a fixing assembly, a circuit board, a lens assembly, and a buffering pad. The fixing assembly defines a chamber, and the circuit board is partially disposed in the chamber. The lens assembly is disposed on the circuit board, and the lens assembly is also partially disposed in the chamber. The buffering pad made of thermally conductive silicon is disposed in the chamber and is disposed between the circuit board and the fixing assembly. In the event of being dropped or suffering vibration, the buffering pad disperses and absorbs stress on the fixing assembly to prevent breakage.
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Patent Agency Ranking
公开(公告)号：US11240413B2
公开(公告)日：2022-02-01
申请号：US16545238
申请日：2019-08-20
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
IPC: H04N5/225 , H02P7/025 , G02B7/08 , H02K41/035
Abstract: A voice coil motor strongly attached to the base of a camera module comprises the base and a casing. The casing and the base are interlocked with each other. The casing is a hollow structure. The casing comprises a top surface and a side wall surrounding the top surface. The side wall and the base are engaged with each other. The side wall is extended in parts to form at least one extending leg. The extending leg extends to a side of the base away from the top surface and is bent toward the base.
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公开(公告)号：US10979608B2
公开(公告)日：2021-04-13
申请号：US16250172
申请日：2019-01-17
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Long-Fei Zhang , Shin-Wen Chen , Kun Li , Xiao-Mei Ma
Abstract: An imaging device proofed against ghosting and flaring in captured images includes a lens barrel and a lens module received in the lens barrel. The lens barrel comprises an inner surface and a supporting portion extending radially from the inner wall surface. The supporting portion has through hole for light entry, the through hole comprises a reflecting surface, the supporting portion comprises a top surface and a bottom surface, the reflecting surface connects the top surface and the bottom surface, and a plurality of light-scattering structures are formed on the reflecting surface.
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公开(公告)号：US10935750B2
公开(公告)日：2021-03-02
申请号：US16101707
申请日：2018-08-13
Inventor： Long-Fei Zhang , Shin-Wen Chen , Xiao-Mei Ma , Kun Li
IPC: G02B7/04
Abstract: A voice coil motor of reduced thickness includes a pedestal and a housing. The side walls of the pedestal are formed with a metal sheet. The housing includes top and side plates, the side plates perpendicularly extending from an edge of the top plate. The side plate is notched, the housing covers the pedestal, and the at least one notch exposes a portion of the metal sheet for purposes of attachment between fixation area the housing and the pedestal fixation area.
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公开(公告)号：US11347042B2
公开(公告)日：2022-05-31
申请号：US16680812
申请日：2019-11-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Kun Li , Long-Fei Zhang
Abstract: A lens module includes a printed circuit board, a lens component, and at least two electric conductors. The lens component includes a first lens and a microscope base, the first lens is formed on the microscope base, the microscope base is formed on the printed circuit board, and the first lens is electrically conductive and deforms under voltage. The first lens is electrically connected to the printed circuit board by the electric conductors. The printed circuit board outputs a voltage to the first lens through the electric conductors; the first lens deforms according to the voltage thereby changing a focal distance of light passing through the first lens. The disclosure also relates to an electronic device using the lens module. The lens module can has a zoom function and has a litter volume.
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公开(公告)号：US10965855B2
公开(公告)日：2021-03-30
申请号：US16438658
申请日：2019-06-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： Shin-Wen Chen , Long-Fei Zhang , Kun Li , Xiao-Mei Ma
Abstract: A lens module includes a first circuit board, a second circuit board, an image sensor, a signal line, a mounting bracket, a filter, and a lens unit. The first circuit board defines a first through hole. The second circuit board is coupled to the first circuit board. The second circuit board defines a second through hole aligned with the first through hole. A width of the first through hole is larger than a width of the second through hole. The image sensor is received in the second through hole. The signal line couples the image sensor to the second circuit board. The mounting bracket is disposed on a side of the first circuit board facing away from the second circuit board. The filter is disposed on the mounting bracket. The lens unit is disposed on the mounting bracket.
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