Semiconductor device package and method for use thereof

    公开(公告)号:US10693020B2

    公开(公告)日:2020-06-23

    申请号:US15995510

    申请日:2018-06-01

    Abstract: An optical detector device including: a glass substrate having conductive traces plated thereon; a semiconductor device having an optical detector exposed on a side facing the glass substrate, the semiconductor device further including a plurality of bond pads electrically coupled to a first subset of the conductive traces; a metallic seal structure bonding a side of the glass substrate having the conductive traces with the side of the semiconductor device facing the glass substrate; and a plurality of conductive structures outside of a perimeter of the semiconductor device, the plurality of conductive structures being electrically coupled to a second subset of the conductive traces.

    Semiconductor Device Package and Method for Use Thereof

    公开(公告)号:US20190371944A1

    公开(公告)日:2019-12-05

    申请号:US15995510

    申请日:2018-06-01

    Abstract: An optical detector device including: a glass substrate having conductive traces plated thereon; a semiconductor device having an optical detector exposed on a side facing the glass substrate, the semiconductor device further including a plurality of bond pads electrically coupled to a first subset of the conductive traces; a metallic seal structure bonding a side of the glass substrate having the conductive traces with the side of the semiconductor device facing the glass substrate; and a plurality of conductive structures outside of a perimeter of the semiconductor device, the plurality of conductive structures being electrically coupled to a second subset of the conductive traces.

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