公开(公告)号：US12270709B2

公开(公告)日：2025-04-08

申请号：US17329366

申请日：2021-05-25

Applicant: TXC CORPORATION

Inventor： Tzong-Sheng Lee ,  Jen-Wei Luo ,  Chia-Hao Weng ,  Chun-Chi Lin ,  Ting-Chun Hsu ,  Hui-Jou Yu ,  Yi-Hung Lin ,  Sung-Hung Lin

IPC: G01J5/068

Abstract: An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.