公开(公告)号：US10034364B2

公开(公告)日：2018-07-24

申请号：US15134526

申请日：2016-04-21

Applicant: Kitagawa Industries Co., Ltd. ,  TYK Corporation

Inventor： Yasuhiro Kawaguchi ,  Masataka Kubo

IPC: H01L23/373 ,  H05K1/02 ,  F28F13/00 ,  F28F21/04

Abstract: An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.

公开(公告)号：US12195400B2

公开(公告)日：2025-01-14

申请号：US17213793

申请日：2021-03-26

Applicant: TYK CORPORATION

Inventor： Yasuta Koike ,  Masataka Kubo

IPC: C04B35/14 ,  C04B35/443 ,  F27D3/12

Abstract: A composition for a heat treatment jig includes: alumina at a weight ratio within the range of 5% or more and 25% or less; mullite at a weight ratio within the range of 0% or more and 35% or less; cordierite at a weight ratio within the range of 15% or more and 35% or less; spinel at a weight ratio within the range of 0% or more and 35% or less; and fused silica at a weight ratio within the range of 15% or more and 50% or less. The composition for a heat treatment jig is used for the method of manufacturing a heat treatment jig, such as a heat treatment container.