公开(公告)号：US20070241438A1

公开(公告)日：2007-10-18

申请号：US11783874

申请日：2007-04-12

申请人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

发明人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

IPC分类号： H01L23/02

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a strip format of a semiconductor package board and an array thereof, in which a dummy area of the strip format of the semiconductor package board is formed into a predetermined shape such that, when several strip formats of semiconductor package boards are arranged on a panel, the number of strip formats of semiconductor package boards arranged on the panel can be increased.

摘要翻译： 这里公开了一种半导体封装板及其阵列的条形格式，其中半导体封装板的条形格式的虚拟区域形成为预定形状，使得当半导体封装板的多个条形格式布置在 可以增加布置在面板上的半导体封装板的条形格式的数量。