公开(公告)号：US12165909B2

公开(公告)日：2024-12-10

申请号：US17871826

申请日：2022-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Bo-Ru Chen ,  Yan-Hong Liu ,  Che-Fu Chen

IPC: H01L21/687 ,  C23C16/458 ,  H01J37/32 ,  H01L21/683 ,  C23C16/455 ,  H01L21/768

Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.

公开(公告)号：US11600517B2

公开(公告)日：2023-03-07

申请号：US16541450

申请日：2019-08-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Bo-Ru Chen ,  Yan-Hong Liu ,  Che-Fu Chen

IPC: H01L21/687 ,  H01L21/683 ,  C23C16/458 ,  H01J37/32 ,  H01L21/768 ,  C23C16/455

Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.