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公开(公告)号:US12165909B2
公开(公告)日:2024-12-10
申请号:US17871826
申请日:2022-07-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Bo-Ru Chen , Yan-Hong Liu , Che-Fu Chen
IPC: H01L21/687 , C23C16/458 , H01J37/32 , H01L21/683 , C23C16/455 , H01L21/768
Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.
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公开(公告)号:US11600517B2
公开(公告)日:2023-03-07
申请号:US16541450
申请日:2019-08-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Bo-Ru Chen , Yan-Hong Liu , Che-Fu Chen
IPC: H01L21/687 , H01L21/683 , C23C16/458 , H01J37/32 , H01L21/768 , C23C16/455
Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.
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