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公开(公告)号:US20240379462A1
公开(公告)日:2024-11-14
申请号:US18779481
申请日:2024-07-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hong-Shyang Wu , Kuo-Ming Wu
IPC: H01L21/8258 , H01L21/762 , H01L21/768 , H01L21/84 , H01L23/535 , H01L27/12
Abstract: In an embodiment, a device includes: a gallium nitride device on a substrate, the gallium nitride device including an electrode; a dielectric layer on and around the gallium nitride device; an isolation layer on the dielectric layer; a semiconductor layer on the isolation layer, the semiconductor layer including a silicon device; a through via extending through the semiconductor layer, the isolation layer, and the dielectric layer, the through via electrically and physically coupled to the electrode of the gallium nitride device; and an interconnect structure on the semiconductor layer, the interconnect structure including metallization patterns electrically coupled to the through via and the silicon device.
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公开(公告)号:US20230282525A1
公开(公告)日:2023-09-07
申请号:US17748363
申请日:2022-05-19
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hong-Shyang Wu , Kuo-Ming Wu
IPC: H01L21/8258 , H01L27/12 , H01L23/535 , H01L21/84
CPC classification number: H01L21/8258 , H01L27/1207 , H01L27/1203 , H01L23/535 , H01L21/84 , H01L21/76251
Abstract: In an embodiment, a device includes: a gallium nitride device on a substrate, the gallium nitride device including an electrode; a dielectric layer on and around the gallium nitride device; an isolation layer on the dielectric layer; a semiconductor layer on the isolation layer, the semiconductor layer including a silicon device; a through via extending through the semiconductor layer, the isolation layer, and the dielectric layer, the through via electrically and physically coupled to the electrode of the gallium nitride device; and an interconnect structure on the semiconductor layer, the interconnect structure including metallization patterns electrically coupled to the through via and the silicon device.
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