HYBRID INTEGRATED CIRCUIT DIES
    1.
    发明申请

    公开(公告)号:US20240379462A1

    公开(公告)日:2024-11-14

    申请号:US18779481

    申请日:2024-07-22

    Abstract: In an embodiment, a device includes: a gallium nitride device on a substrate, the gallium nitride device including an electrode; a dielectric layer on and around the gallium nitride device; an isolation layer on the dielectric layer; a semiconductor layer on the isolation layer, the semiconductor layer including a silicon device; a through via extending through the semiconductor layer, the isolation layer, and the dielectric layer, the through via electrically and physically coupled to the electrode of the gallium nitride device; and an interconnect structure on the semiconductor layer, the interconnect structure including metallization patterns electrically coupled to the through via and the silicon device.

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