公开(公告)号：US11069642B2

公开(公告)日：2021-07-20

申请号：US16409880

申请日：2019-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Shu Lin ,  Hsuan-Ning Shih

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/538

Abstract: A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. The first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.