公开(公告)号：US20250159846A1

公开(公告)日：2025-05-15

申请号：US18506366

申请日：2023-11-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Sheng LIN ,  Chung-Chiu WU

IPC: H05K7/20

Abstract: A method includes: forming a cooled device by cooling a device in and by a first container of an immersion cooler; performing semiconductor processing by a processing tool in data communication with the cooled device; determining whether the cooled device is in a condition to be removed from the immersion cooler; in response to the cooled device not being in the condition, cooling the device by the immersion cooler; and in response to the cooled device being in the condition, removing the device from the first container, including: positioning a second container over the first container; and with the second container in place covering the first container: opening a lid of the first container; and removing the device from the first container.