公开(公告)号：US20230040030A1

公开(公告)日：2023-02-09

申请号：US17743999

申请日：2022-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Shien Chen ,  Tin-Hao Kuo ,  Hsu-Hsien Chen ,  Yu-chih Huang

IPC: H01L21/66 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

Abstract: A method of forming a semiconductor package includes attaching a first package component to a first carrier; attaching a second package component to the first carrier, the second package component laterally displaced from the first package component; attaching a third package component to the first package component, the third package component being electrically connected to the first package component; removing the first carrier from the first package component and the second package component; after removing the first carrier, performing a first circuit probe test on the second package component to obtain first test data of the second package component; and comparing the first test data of the second package component with prior data of the second package component.