专利检索 ap:("Taiwan Semiconductor Manufacturing Company Limited") AND inv:"Tung-Liang Shao" 第 1 页

1.

发明授权
Semiconductor package including thermal interface structures and methods of forming the same 有权

公开(公告)号：US11955405B2

公开(公告)日：2024-04-09

申请号：US17577069

申请日：2022-01-17

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Jen Yu Wang , Chung-Jung Wu , Sheng-Tsung Hsiao , Tung-Liang Shao , Chih-Hang Tung , Chen-Hua Yu

IPC分类号： H01L23/373 , H01L23/473

CPC分类号： H01L23/3736 , H01L23/473

摘要： A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.