Apparatus for forming leads of a semiconductor device
    1.
    发明授权
    Apparatus for forming leads of a semiconductor device 失效
    用于形成半导体器件的引线的装置

    公开(公告)号:US4923386A

    公开(公告)日:1990-05-08

    申请号:US279800

    申请日:1988-12-05

    摘要: A lead forming apparatus suitable for use in forming the leads of a semiconductor device is disclosed. The apparatus has a housing for supporting a stationary lower mold half, a support plate arranged to freely move with respect to the housing for supporting a movable mold half in opposition to the lower mold half, a moving device for moving the support plate to cause the movable mold half toward and away from the lower mold half, and an adjusting device for adjusting the position of the support plate with respect to the moving device. The moving device has a crankshaft, a driving device for rotating the crankshaft about its axis, and a coupler transmitting the rotation of the crankshaft to the support plate as a linear motion. The apparatus having the above-described arrangement can be operated with a reduced noise level and a reduced impact and, furthermore, achieves good operability.

    摘要翻译: 公开了一种适用于形成半导体器件的引线的引线形成装置。 该装置具有用于支撑固定的下半模的壳体,相对于壳体自由移动的支撑板,用于支撑与下半模相对的可动半模;移动装置,用于使支撑板移动, 可移动模具半部和远离下半模,以及用于调节支撑板相对于移动装置的位置的调节装置。 移动装置具有曲轴,用于使曲轴围绕其轴线旋转的驱动装置和将曲轴的旋转作为直线运动传递到支撑板的联轴器。 具有上述布置的装置可以以降低的噪声水平和减小的冲击力来操作,并且还实现良好的可操作性。