公开(公告)号：US20100011920A1

公开(公告)日：2010-01-21

申请号：US12503970

申请日：2009-07-16

申请人： Takanobu AKIYAMA ,  Satoshi Kato ,  Hiroyuki Kakishima ,  Sumihisa Kondou

发明人： Takanobu AKIYAMA ,  Satoshi Kato ,  Hiroyuki Kakishima ,  Sumihisa Kondou

IPC分类号： B23B1/00 ,  B23B5/36 ,  B23B7/00

CPC分类号： B23B1/00 ,  B23B3/162 ,  B23B27/20 ,  B23B2220/12 ,  Y10T82/10 ,  Y10T82/13 ,  Y10T82/2502

摘要： There is provided a V-groove machining method and apparatus which, by measuring the depth of a V groove cut by a cutting tool and correcting the cutting depth of the cutting tool based on the measurement data, enables high precision machining of four-sided pyramids having vertices of a uniform height. The V-groove machining method includes the steps of: feeding a cutting tool relative to a workpiece in a first direction to create a first V groove, extending in the first direction, in the surface of the workpiece, and repeating this machining operation to create first V grooves at a predetermined pitch; moving the cutting tool along one of the first V grooves and scanning the first V groove with a distance sensor, disposed near the cutting tool, to measure the distance to the bottom of the first V groove, thereby detecting undulation of the bottom of the first V groove along the first direction; and feeding the cutting tool relative to the workpiece in a second direction orthogonal to the first direction to create a second V groove in the surface of the workpiece, and repeating this machining operation while correcting the position of the cutting tool in the machining position for each second V groove based on the results of detection of the undulation, thereby creating second V grooves at a predetermined pitch.

摘要翻译： 提供了一种V槽加工方法和装置，通过测量由切削工具切割的V槽的深度，并且基于测量数据校正切削刀具的切削深度，能够实现四边锥体的高精度加工 具有均匀高度的顶点。 V槽加工方法包括以下步骤：在第一方向上相对于工件进给切削工具，以在工件的表面中产生在第一方向上延伸的第一V形槽，并重复该加工操作以产生 第一V槽以预定间距; 沿着所述第一V槽中的一个槽移动所述切削工具，并且设置在所述切削工具附近的距离传感器扫描所述第一V槽以测量到所述第一V槽的底部的距离，从而检测所述第一V槽的底部的起伏 V槽沿第一方向; 并且在与所述第一方向正交的第二方向上相对于所述工件进给所述切削工具，以在所述工件的表面中产生第二V形槽，并且在每个所述加工位置校正所述切削工具在所述加工位置中的位置的同时重复该加工操作 基于波动检测结果的第二V槽，从而以预定间距产生第二V槽。

公开(公告)号：US20110217905A1

公开(公告)日：2011-09-08

申请号：US13035220

申请日：2011-02-25

申请人： Takanobu AKIYAMA ,  Hiroyuki KAKISHIMA

发明人： Takanobu AKIYAMA ,  Hiroyuki KAKISHIMA

IPC分类号： B24B49/12

CPC分类号： B24B49/12

摘要： The invention relates to a grinding machine for grinding a workpiece, which has been set on a chuck top surface, by moving a rotating grinding wheel in relation to the workpiece. The grinding machine includes: a microscope configured to be vertically movable; a CCD camera configured to take an image viewed through the microscope; and an image processor configured to process the image taken by the CCD camera to measure a vertical distance between a reference plane of the microscope and an object of the microscope. The image processor is adapted to measure the vertical distance between the reference plane of the microscope and the object of the microscope based on sharpness of the image, which corresponds to how clear the microscope is focused.

摘要翻译： 本发明涉及一种用于通过相对于工件移动旋转的砂轮而将已经设置在卡盘顶表面上的工件进行研磨的磨床。 研磨机包括：显微镜，被配置为可垂直移动; 配置成拍摄通过显微镜观看的图像的CCD照相机; 以及图像处理器，被配置为处理由CCD照相机拍摄的图像，以测量显微镜的参考平面与显微镜的物体之间的垂直距离。 图像处理器适于基于图像的清晰度来测量显微镜的参考平面和显微镜的对象之间的垂直距离，其对应于显微镜被聚焦的清晰度。

公开(公告)号：US20110318877A1

公开(公告)日：2011-12-29

申请号：US13159192

申请日：2011-06-13

申请人： Takanobu AKIYAMA

发明人： Takanobu AKIYAMA

IPC分类号： H01L21/78

CPC分类号： B23K26/40 ,  B23K26/082 ,  B23K26/53 ,  B23K26/60 ,  B23K2103/172 ,  B23K2103/50 ,  B28D5/0005

摘要： The present invention provides a dicing method that achieves excellent dicing properties at low costs by removing a metal film through a metal processing operation with a diamond tool and then performing pulse laser beam irradiation. The dicing method is a method of dicing a substrate to be processed, devices being formed in the substrate to be processed, a metal film being formed on one surface of the substrate to be processed. The dicing method includes: placing the substrate to be processed onto a first stage; forming a groove portion by removing the metal film through a metal processing operation with a diamond tool; placing the substrate to be processed onto a second stage; generating a clock signal; emitting a pulse laser beam synchronized with the clock signal to the groove portion of the substrate to be processed; moving the substrate to be processed and the pulse laser beam relative to each other; switching the pulse laser beam between irradiation and non-irradiation of the substrate to be processed on a light pulse basis by controlling passing and blocking of the pulse laser beam with a pulse picker in synchronization with the clock signal; and forming cracks in the substrate to be processed, the cracks reaching the substrate surface.

摘要翻译： 本发明提供一种切割方法，其通过金刚石工具的金属加工操作除去金属膜，然后进行脉冲激光束照射，以低成本实现优良的切割性能。 切割方法是在被处理基板上形成的被处理基板的装置，形成在被处理基板的一个面上的金属膜的切割方法。 切割方法包括：将要处理的基板放置在第一台上; 通过金刚石工具的金属加工操作去除金属膜形成凹槽部分; 将要处理的基板放置在第二台上; 产生时钟信号; 将与时钟信号同步的脉冲激光束发射到待处理的基板的槽部; 移动要处理的基板和相对于彼此的脉冲激光束; 通过与时钟信号同步地控制脉冲激光束的脉冲激光束的通过和阻断，在脉冲的基础上切换脉冲激光束的照射和不照射待处理的基板; 并在待处理的基板上形成裂纹，裂纹到达基板表面。