公开(公告)号：US5708293A

公开(公告)日：1998-01-13

申请号：US777495

申请日：1996-12-30

申请人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

发明人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49551 ,  H01L23/49503 ,  H01L23/4951 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079

摘要： In a unit part of a lead frame for mounting a semiconductor chip, connecting leads and supporting leads extending from a lead frame main body toward a semiconductor chip mounting region are formed. Between each supporting lead and the lead frame main body, a movable part and a spring part for elastically supporting the movable part are disposed. The tip portion of the supporting lead connected with the movable part extends to the inside of the semiconductor chip mounting region in the natural state of the movable part, so that the tip portion butts against the side face of a semiconductor chip when the semiconductor chip is mounted. Thus, the semiconductor chip can be supported and fixed by using a bias force applied by the spring part. The base portions of the supporting leads, the movable part and the spring part do not remain in a package, and hence do not cause a stress in the package and do not increase the volume of the package. Thus, the invention provides a lead frame for forming a LOC package with high reliability which can contain a semiconductor chip having a large area within a regulated volume.

摘要翻译： 在用于安装半导体芯片的引线框架的单位部分中，形成从引线框架主体朝向半导体芯片安装区域延伸的连接引线和支撑引线。 在每个支撑引线和引线框架主体之间设置有用于弹性地支撑可动部件的可动部件和弹簧部件。 与可动部连接的支撑引线的前端部在可动部的自然状态下延伸到半导体芯片安装区域的内部，使得当半导体芯片为半导体芯片时，前端部抵靠半导体芯片的侧面 安装。 因此，可以通过使用由弹簧部分施加的偏压力来支撑和固定半导体芯片。 支撑引线，可动部分和弹簧部分的基部不保持在包装中，因此不会在包装中引起应力，并且不增加包装的体积。 因此，本发明提供了一种用于形成具有高可靠性的LOC封装的引线框架，其可以包含在调节体积内具有大面积的半导体芯片。