公开(公告)号：US08872313B2

公开(公告)日：2014-10-28

申请号：US13322336

申请日：2009-05-26

申请人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

发明人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

IPC分类号： B65D81/113 ,  B65D5/50 ,  B65D85/38

CPC分类号： B65D5/5061 ,  B65D85/38

摘要： A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

摘要翻译： 封装装置用于封装包括形成的基板，模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括：保持单元，其具有插入槽并且用于保持功率半导体器件，插入槽各自为开口，功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中，开口的边缘形成 与模具部件和基板接触; 以及容纳盒，其包含保持单元。 插入槽被提供到保持单元，使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。

公开(公告)号：US20120074543A1

公开(公告)日：2012-03-29

申请号：US13322336

申请日：2009-05-26

申请人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

发明人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

IPC分类号： H01L23/552

CPC分类号： B65D5/5061 ,  B65D85/38

摘要： A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

摘要翻译： 封装装置用于封装包括形成的基板，模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括：保持单元，其具有插入槽并且用于保持功率半导体器件，插入槽各自为开口，功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中，开口的边缘形成 与模具部件和基板接触; 以及容纳盒，其包含保持单元。 插入槽被提供到保持单元，使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。