公开(公告)号：US20140369883A1

公开(公告)日：2014-12-18

申请号：US14473599

申请日：2014-08-29

申请人： Takefumi ITO ,  Toshikazu KAWAHATA ,  Yumiko IWASHITA ,  Toshihiro KURITA ,  Takayuki NAGAI

发明人： Takefumi ITO ,  Toshikazu KAWAHATA ,  Yumiko IWASHITA ,  Toshihiro KURITA ,  Takayuki NAGAI

IPC分类号： H01B1/02 ,  C22C9/06

CPC分类号： H01B1/026 ,  C22C9/06

摘要： To obtain a copper alloy having a tensile strength of 700 N/mm2 or more and a conductivity of 60% IACS or more, a copper alloy of the present invention comprises from 0.8 mass % to 1.8 mass % of Co, from 0.16 mass % to 0.6 mass % of Si, and the balance of Cu and unavoidable impurities, in which a mass ratio of Co to Si (Co/Si) is between 3.0 and 5.0; a size of inclusions to be precipitated in the copper alloy is 2 μm or less; and a total volume of the inclusions having a size of between 0.05 μm and 2 μm in the copper alloy is 0.5 vol % or less.

摘要翻译： 为了得到拉伸强度为700N / mm 2以上且导电率为60％IACS以上的铜合金，本发明的铜合金包含0.8质量％〜1.8质量％的Co，0.16质量％〜 0.6质量％的Si，余量为Co和Si（Co / Si）的质量比为3.0〜5.0的Cu和不可避免的杂质; 在铜合金中沉淀的夹杂物的尺寸为2μm以下; 并且铜合金中的具有0.05μm和2μm之间的尺寸的夹杂物的总体积为0.5体积％以下。