公开(公告)号：US4395320A

公开(公告)日：1983-07-26

申请号：US231610

申请日：1981-02-05

申请人： Tatsuji Kasashima ,  Shuji Morita ,  Hiroyuki Hayami ,  Seiroku Ose ,  Yoshinori Takada ,  Fumihiro Nozaki

发明人： Tatsuji Kasashima ,  Shuji Morita ,  Hiroyuki Hayami ,  Seiroku Ose ,  Yoshinori Takada ,  Fumihiro Nozaki

IPC分类号： C25D5/22 ,  C25D7/06 ,  C25D17/00

CPC分类号： C25D7/0607 ,  C25D5/22

摘要： A method and an apparatus are disclosed for coating a metallic wire with a similar or dissimilar metallic plating layer having the desired uniform thickness and a compact metallic structure by passing the wire through electrolytic baths and through surface smoothing stations. The wire is passed through an electrolytic bath to coat the wire with a plating layer, then pressed against the peripheral surfaces of rotatable rollers to smooth the surface of the plating layer substantially over the entire periphery thereof. Subsequently the wire is coated with an electrolytic plating layer over the smoothed surface of the wire.

摘要翻译： 公开了一种方法和装置，用于通过使电线通过电解槽和通过表面平滑工位来涂覆具有所需均匀厚度和紧凑金属结构的类似或不同金属镀层的金属线。 电线穿过电解槽，用电镀层涂覆线，然后压在可旋转辊的周边表面上，使镀层的表面基本上在其整个周边上平滑。 随后，电线在平滑的电线表面上涂覆有电解镀层。