摘要:
An electromagnetic interference (EMI) gasket for an electronic module comprises a valley feature formed on one side of an EMI gasket and a crown feature formed on the other side of the EMI gasket in order to complement the valley. One or more EMI gaskets are used to construct a shield across the opening of a module cage or rack. Each gasket forms a link in a series of modules, in order to complete a seal across the opening in the cage. A perpendicular pressure forces the module gaskets to center and align evenly as the crown and valley of the opposite features nest together. The modules can be then pressed together and the overlap of the crown and valley acts to center the alignment and create a pressure for satisfactory EMI grounding and the reduction of EMI leakage.
摘要:
An electromagnetic interference (EMI) gasket for an electronic module comprises a valley feature formed on one side of an EMI gasket and a crown feature formed on the other side of the EMI gasket in order to complement the valley. One or more EMI gaskets are used to construct a shield across the opening of a module cage or rack. Each gasket forms a link in a series of modules, in order to complete a seal across the opening in the cage. A perpendicular pressure forces the module gaskets to center and align evenly as the crown and valley of the opposite features nest together. The modules can be then pressed together and the overlap of the crown and valley acts to center the alignment and create a pressure for satisfactory EMI grounding and the reduction of EMI leakage.
摘要:
Embodiments of the present invention provide a multi-fan cooling system in which redundancy in airflow across a plurality of electrical boards is maintained. This redundancy is provided by having an ability to at least partially divert airflow from a functioning fan to an electrical board for which its corresponding fan has failed. According to various embodiments of the present invention, the multi-fan cooling system comprises two fans located proximate to each other. An airflow plenum couples and distributes air from the two fans across a plurality of electrical boards. In certain embodiments, the plenum comprises stacked outlets that distribute airflow from the two fans across the plurality of electrical boards. During normal operation, this airflow is approximately evenly distributed across the electrical boards. However, if one of the fans fails, the plenum causes air from the single operating fan to still be distributed across the plurality of electrical boards. In one embodiment of the invention, the plenum includes a flap that covers an opening for the failed fan to prevent recirculation of airflow back into the failed fan.
摘要:
Embodiments of the present invention provide a multi-fan cooling system in which redundancy in airflow across a plurality of electrical boards is maintained. This redundancy is provided by having an ability to at least partially divert airflow from a functioning fan to an electrical board for which its corresponding fan has failed. According to various embodiments of the present invention, the multi-fan cooling system comprises two fans located proximate to each other. An airflow plenum couples and distributes air from the two fans across a plurality of electrical boards. In certain embodiments, the plenum comprises stacked outlets that distribute airflow from the two fans across the plurality of electrical boards. During normal operation, this airflow is approximately evenly distributed across the electrical boards. However, if one of the fans fails, the plenum causes air from the single operating fan to still be distributed across the plurality of electrical boards. In one embodiment of the invention, the plenum includes a flap that covers an opening for the failed fan to prevent recirculation of airflow back into the failed fan.