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    POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    1.
    发明申请
    POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    抛光机，工件支撑台板，抛光方法及制造半导体器件的方法

    公开(公告)号：US20090264054A1

    公开(公告)日：2009-10-22

    申请号：US12495893

    申请日：2009-07-01

    申请人： Tetsuya SHIRASU ,  Katsuhiko AOYAMA ,  Fumihiko AKABOSHI ,  Kunichirou GOTOH

    发明人： Tetsuya SHIRASU ,  Katsuhiko AOYAMA ,  Fumihiko AKABOSHI ,  Kunichirou GOTOH

    IPC分类号： B24B53/02 ,  B24B29/00

    CPC分类号： B24B37/30

    摘要： A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.

    摘要翻译： 用于临时放置和保持预抛光或后抛光的晶片（工件）的基座（工件支撑台）的顶部上布置有基座垫（工件支撑台垫）。 该基座垫由树脂形成，并且与晶片接触的基座垫的至少一个表面不能吸收流体。 基座垫的组织是致密和平滑的，并且不具有保持流体的任何空腔，例如细孔。