公开(公告)号：US20220310535A1

公开(公告)日：2022-09-29

申请号：US17806694

申请日：2022-06-13

Applicant: Texas Instruments Incorporated

Inventor： Naweed Anjum ,  Michael Gerald Amaro ,  Charles Allen Devries

IPC: H01L23/00 ,  H01L23/495 ,  H05K1/18

Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.