公开(公告)号：US20240145928A1

公开(公告)日：2024-05-02

申请号：US18194438

申请日：2023-03-31

Applicant: Texas Instruments Incorporated

Inventor： Zachary Crawford ,  Mohammad Vatankhah Varnoosfaderani ,  Hassan Ali ,  Claudia Vasanelli ,  Swaminathan Sankaran

IPC: H01Q13/10 ,  H01Q1/22 ,  H01Q13/06

CPC classification number: H01Q13/106 ,  H01Q1/2283 ,  H01Q13/06

Abstract: A device with a circuit board including a top surface and a bottom surface, a package including a bottom surface affixed relative to the top surface of the circuit board, and an antenna structure affixed relative to the bottom surface of the circuit board. The antenna structure extends through an opening in the circuit board.

公开(公告)号：US20230352841A1

公开(公告)日：2023-11-02

申请号：US18091295

申请日：2022-12-29

Applicant: Texas Instruments Incorporated

Inventor： Claudia Vasanelli ,  Hassan Ali ,  Swaminathan Sankaran ,  Mohammad Vatankhah Varnoosfaderani ,  Zachary Crawford

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/42

CPC classification number: H01Q9/0485 ,  H01Q1/2283 ,  H01Q1/422

Abstract: A device with a substrate, the substrate including opposite first and second surfaces, the first surface including metal pads, a dielectric layer between the first and second surfaces, and an opening extending through the dielectric layer and connecting between the first and second surfaces, the opening including first and second ridge structures, each of the first and second ridge structure extending with a uniform cross-section along the opening.