公开(公告)号：US20230305291A1

公开(公告)日：2023-09-28

申请号：US17746284

申请日：2022-05-17

Applicant: Texas Instruments Incorporated

Inventor： Lisa Wesneski ,  Toby Linder ,  Timothy Patterson

IPC: G02B26/08 ,  B81B3/00

CPC classification number: G02B26/0833 ,  B81B3/0013 ,  B81B2201/042

Abstract: Systems and methods to reduce stiction in MEMS devices are disclosed. A microelectromechanical system (MEMS) device includes a substrate; a via supported by the substrate, the via comprising a first metal layer comprising a material; an arm extending away from and supported by the via, the arm comprising the material; and a second metal layer within the via on the first metal layer, wherein the second metal layer comprises nitrogen.

公开(公告)号：US20230273423A1

公开(公告)日：2023-08-31

申请号：US17681151

申请日：2022-02-25

Applicant: Texas Instruments Incorporated

Inventor： Toby Linder ,  John Hamlin ,  Kelly J. Taylor

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00

CPC classification number: G02B26/0833 ,  B81B3/0072 ,  B81C1/00666 ,  B81B2201/042

Abstract: Systems and methods for MEMS devices are disclosed. A microelectromechanical system (MEMS) device includes a substrate, and a MEMS structure supported by the substrate. The MEMS structure includes a first layer of a first material comprising a titanium aluminum alloy. The MEMS structure furth includes an aluminum layer on the first layer.