公开(公告)号：US20240222237A1

公开(公告)日：2024-07-04

申请号：US18603047

申请日：2024-03-12

Applicant: Texas Instruments Incorporated

Inventor： Vivek K. Arora ,  Woochan Kim

IPC: H01L23/495 ,  H01F27/28 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373

CPC classification number: H01L23/49575 ,  H01F27/2804 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3738 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01F2027/2809 ,  H01L2224/48175 ,  H01L2224/48195 ,  H01L2224/73265 ,  H01L2224/92247

Abstract: A power converter package includes a leadframe including first and second die pads, and supports connected to first leads, and second leads. A first semiconductor die including first bond pads is on the first die pad, and a second semiconductor die including second bond pads is on the second die pad. A transformer stack includes a top magnetic sheet and a bottom magnetic sheet on respective sides of a laminate substrate that includes a coil within, and coil contacts. A silicon block is attached to the bottom magnetic sheet and edges of the laminate substrate are attached to the supports. Bond wires are between the first bond pads and the second leads, the second bond pads and the second leads, and the first and second bond pads and the coil contacts. Mold encapsulates the respective semiconductor and the transformer stack. A bottom of the silicon block is exposed from the mold.

公开(公告)号：US20230119127A1

公开(公告)日：2023-04-20

申请号：US17502706

申请日：2021-10-15

Applicant: Texas Instruments Incorporated

Inventor： Vivek K. Arora ,  Woochan Kim

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56 ,  H01F27/28

Abstract: A power converter package includes a leadframe including first and second die pads, and supports connected to first leads, and second leads. A first semiconductor die including first bond pads is on the first die pad, and a second semiconductor die including second bond pads is on the second die pad. A transformer stack includes a top magnetic sheet and a bottom magnetic sheet on respective sides of a laminate substrate that includes a coil within, and coil contacts. A silicon block is attached to the bottom magnetic sheet and edges of the laminate substrate are attached to the supports. Bond wires are between the first bond pads and the second leads, the second bond pads and the second leads, and the first and second bond pads and the coil contacts. Mold encapsulates the respective semiconductor and the transformer stack. A bottom of the silicon block is exposed from the mold.