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公开(公告)号：US20210063497A1
公开(公告)日：2021-03-04
申请号：US17003693
申请日：2020-08-26
Applicant: Texas Instruments Incorporated
Inventor： YONG DENG , JO BITO , BENJAMIN STASSEN COOK
Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.
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