公开(公告)号：US20210159189A1

公开(公告)日：2021-05-27

申请号：US16840705

申请日：2020-04-06

Applicant: Texas Instruments Incorporated

Inventor： Qin Xu Yu ,  Jian Jun Kong ,  She Yu Tang ,  Yun Fu An

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3205 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56

Abstract: In a described example, an electrical apparatus includes: a metal layer formed over a non-device side of a semiconductor device die, the semiconductor device die having devices formed on a device side of the semiconductor device die opposite the non-device side; a first side of the metal layer bonded to a die mount pad on a package substrate; a second side of the metal layer formed over a roughened surface on the non-device side of the semiconductor device die, the roughened surface having an average surface roughness (Ra) between 40 nm and 500 nm; bond pads on the semiconductor device die electrically coupled to conductive leads on the package substrate; and mold compound covering at least a portion of the semiconductor device die and at least a portion of the conductive leads.