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公开(公告)号:US11527611B2
公开(公告)日:2022-12-13
申请号:US17092765
申请日:2020-11-09
发明人: Eric Joseph Nemanick , Yao Y. Lao
摘要: Interconnects may be formed to an electronic device by creating a strong bond between a wire or lead, one or more nanomaterials, and a contacting area on the electronic device. The creating of the strong bond comprises triggering low power air plasma to activate a surface of the one or more nanomaterials forcing the one or more nanomaterials to bond to the surface of the contacting area.