SYSTEMS AND METHODS FOR SAFE AND FLEXIBLE BATTERIES

    公开(公告)号:US20230378573A1

    公开(公告)日:2023-11-23

    申请号:US18322237

    申请日:2023-05-23

    摘要: Disclosed herein is an electronic device encapsulation including a non-permeable coating and at least one pair of leads coupled to an electronic device protruding from the non-permeable coating. Also disclosed herein is a method of encapsulating an electronic device including attaching at least a pair of electric leads to the device, coating the device and a portion of each lead with a non-permeable coating, and curing the non-permeable coating. Further disclosed is an encapsulated system including a device, at least one pair of leads coupled to the device configured to extend from the device and attach to an exterior system, and a non-permeable coating configured to provide a vapor barrier surrounding the device and to provide an exposed portion of the pair of leads.