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公开(公告)号:US20240304690A1
公开(公告)日:2024-09-12
申请号:US18600700
申请日:2024-03-09
发明人: Woongje SUNG , Sundar Isukapati
IPC分类号: H01L29/417 , H01L27/092 , H01L29/16
CPC分类号: H01L29/41783 , H01L27/092 , H01L29/1608
摘要: Embodiments herein include a substrate; a semiconductor layer formed over the substrate; a source formed in the semiconductor layer; a drain formed in the semiconductor layer, whereon the drain is disposed laterally relative to the source; and a gate.