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公开(公告)号:US20200168659A1
公开(公告)日:2020-05-28
申请号:US16619444
申请日:2018-06-01
IPC分类号: H01L27/146 , H01L31/0304 , H01L21/02 , H01L31/103
摘要: A method of fabricating a field-effect transistor in which a native oxide layer is removed prior to etching a gate recess. The cleaning step ensures that the etch of the gate recess starts at the same time across an entire sample, such that a uniform gate recess depth and profile can be achieved across an array of field-effect transistors. This results in a highly uniform switch-off voltage for the field-effect transistors in the array.