公开(公告)号：US20230148361A1

公开(公告)日：2023-05-11

申请号：US17969709

申请日：2022-10-20

申请人： The University of British Columbia

发明人： Mathew John MITCHELL ,  Lukas CHROSTOWSKI ,  Becky LIN ,  Kashif Masud AWAN ,  Shangxuan YU ,  Donald WITT ,  Seyediman TAGHAVI

IPC分类号： H01S5/0237 ,  G02B6/136

CPC分类号： H01S5/0237 ,  G02B6/136 ,  G02B2006/12121

摘要： Systems and methods for fabricating a semiconductor chip with an integrated laser diode (or other optical component). An example method may comprise fabricating a recess shaped to receive the optical component. The method may also comprise metallizing at least one surface of the recess. The method may also comprise coupling the optical component to the at least one metallized surface of the recess. The component may comprise a laser diode comprising a p-type semiconductor and an n-type semiconductor. The n-type semiconductor may be electrically coupled to the at least one metallized surface of the recess. The method may also comprise optically coupling an optical output of the laser diode (or other optical component) to an optical input of a photonic interface of the chip with a photonic wire bond and/or at least one polymer lens.