公开(公告)号：US20210371967A1

公开(公告)日：2021-12-02

申请号：US17286629

申请日：2019-10-21

申请人： The University of Warwick

发明人： Silvia VARAGNOLO ,  Ross HATTON

IPC分类号： C23C14/04 ,  H01B5/14 ,  C23C14/02 ,  C23C14/14 ,  C23C14/24 ,  C23C14/58

摘要： A method is described for selectively depositing a metallic layer (10) including one or more of copper, silver and gold. The method includes depositing a fluorinated layer (5) over a surface (1, 4). The fluorinated layer (5) has a thickness sufficient to substantially prevent deposition of the copper, silver and/or gold between the fluorinated layer (5) and the surface (1, 4) during a subsequent evaporation step using a given deposition rate. The method also includes forming the metallic layer (10) by evaporating, at the given deposition rate, the copper, silver and/or gold over the surface (1, 4) and the fluorinated layer (5). The copper, silver and/or gold preferentially adhere to the portions of the surface (1, 4) not covered by the fluorinated layer (s).