Apparatus for applying secondary layer on board surface
    1.
    发明授权
    Apparatus for applying secondary layer on board surface 失效
    用于在板表面上施加二次层的装置

    公开(公告)号:US4089740A

    公开(公告)日:1978-05-16

    申请号:US653810

    申请日:1976-01-30

    摘要: Method and apparatus for applying a secondary layer or coating on surfaces of wet formed board materials are disclosed. The secondary layer is applied to the wet mat material of the board being manufactured during press rolling of the wet mat. The secondary layer material is supplied in the form of a slurry which is caused to adhere to the surface of a wire screen. The wire screen surface bearing the layer of slurry material is then pressed onto the mat surface to deposit the slurry layer thereon.

    摘要翻译: 公开了在湿成型板材料的表面上施加二次层或涂层的方法和装置。 第二层被施加到在湿垫的压制过程中制造的板的湿垫材料。 二次层材料以浆料的形式供给,其被附着在丝网的表面上。 然后将含有浆料材料层的丝网表面压在垫表面上以在其上沉积浆料层。